Optoelectronic device and method for manufacturing the same

A method of fabricating an optoelectronic device, comprising:

• providing a substrate having a first surface and a normal direction perpendicular to the first surface;
• forming a first semiconductor layer on the first surface of the substrate;
• patterning the first semiconductor layer to form a plurality of the first semiconductor rods and exposing partial of the first surface of the substrate;
• providing a first protection layer to cover on the sidewall of the plurality of the first semiconductor rods and the exposed partial of the first surface of the substrate;
• forming a first buffer layer on the plurality of the first semiconductor rods wherein the first buffer layer having a first surface and a second surface opposite to the first surface, and the plurality of the first semiconductor rods directly contacted with the first surface;
• and
• forming at least one first hollow component among the first semiconductor rods, the first surface of the substrate, and the first surface of the first buffer layer, wherein the width of the first hollow component is further defined as the largest size of the first hollow component perpendicular to the normal direction of the substrate and the height of the first hollow component is further defined as the largest size of the first hollow component parallel with the normal direction of the substrate and the ratio of the height and the width of the first hollow component is 1/5-3.