Group III nitride semiconductor light-emitting device and production method therefor
AssigneeToyoda Gosei Co., Ltd.
InventorRyo Nakamura
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AssigneeToyoda Gosei Co., Ltd.
InventorRyo Nakamura
Estimating the term…
The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance and high electrostatic breakdown voltage. The Group III nitride semiconductor light-emitting device has a layered structure in which an n-type contact layer, an ESD layer, an n-type cladding layer, a light-emitting layer, a p-type cladding layer, and a p-type contact layer are deposited on a sapphire substrate. The ESD layer has a pit. The n-type cladding layer and the light-emitting layer are formed without burying the pit. The pit has a diameter of 110 nm to 150 nm at an interface between the n-type cladding layer and the light-emitting layer. The barrier layer of the light-emitting layer is formed of AlGaN having an Al composition ratio of 3% to 7%.
A Group III nitride semiconductor light-emitting device comprising an n-type layer, a light-emitting layer, and a p-type layer, which are sequentially deposited, the n-type layer having a pit, wherein the pit diameter is 110 nm to 150 nm at an interface between the light-emitting layer and the n-type layer;
A method for producing a Group III nitride semiconductor light-emitting device comprising an n-type layer, a light-emitting layer, and a p-type layer, which are sequentially deposited, the n-type layer having a pit, the method comprising:
Dependencies are inferred from the claim text.