Pattern measuring method and pattern measuring device
AssigneeHitachi High-Technologies Corporation
InventorsTakumichi Sutani, Ryoichi Matsuoka, Hidetoshi Morokuma, Hitoshi Komuro, Akiyuki Sugiyama
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Abstract
A pattern measuring method and device are provided which set a reference position for a measuring point to be measured by a scanning electron microscope and the like, based on position information of a reference pattern on an image acquired from the scanning electron microscope and based on a positional relation, detected by using design data, between the measuring point and the reference pattern formed at a position isolated from the measuring point.
Claims8
A pattern measuring device comprising:
- a processor configured to measure a pattern on a specimen based on an image;
- wherein the processor acquires an image of an area including a measurement point on the specimen and a reference pattern arranged at a position isolated from the measurement point, executes a position alignment between an area of the acquired image not including the measurement point but including the reference pattern different from a measurement pattern including said measurement point and an area of design data not including the measurement point but including the reference pattern different from the measurement pattern including said measurement point, by using the reference pattern selectively, so that the measurement point in the acquired image is shifted in conjunction with the reference pattern in the acquired image, and, after the execution of the position alignment, measures a distance between an edge of a pattern of the measurement point in the image in which the position alignment between the reference patterns is executed and an edge of a pattern of the measurement point in the design data.
A storage medium storing a computer-readable program for performing measurement of a pattern on an acquired image including measurement pattern,
- wherein the program acquires an image of an area including a measurement point on the specimen and a reference pattern arranged at a position isolated from the measurement point, executes a position alignment between an area of the acquired image not including the measurement point but including the reference pattern different from a measurement pattern including said measurement point and an area of design data not including the measurement point but including the reference pattern different from the measurement pattern including said measurement point, by using the reference pattern selectively, so that the measurement point in the acquired image is shifted in conjunction with the reference pattern in the acquired image, and, after the execution of the position alignment, measures a distance between an edge of a pattern of the measurement point in the image in which the position alignment between the reference patterns is executed and an edge of a pattern of the measurement point in the design data.
Dependencies are inferred from the claim text.