Back to results
US 8,507,805 B2Granted
Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
AssigneeElpida Memory, Inc.
InventorSeiya Fujii
Life of this patent
Estimating the term…
Abstract
In a wiring board according to the present invention, a substrate, a solder resist provided on the substrate, a land, a wiring line, and a connection portion connecting the wiring line and the land, the connection portion is provided with a recess as a non-flat portion, and is formed to comprise a width greater than a width of the wiring line and smaller than a width (diameter) of the land, the width of the connection portion being gradually increased from the wiring line toward the land.
Claims18
A board comprising:
- a substrate including a first surface;
- a land provided over the first surface of the substrate and can be mounted a contact member;
- a wiring line provided over the first surface of the substrate and arranged adjacent to the land;
- a connection portion electrically coupling the land to the wiring line, the connection portion including a non-flat part, the non-flat part configured to be covered with the contact member;
- and a solder resist provided over the first surface of the substrate and the wiring line, and does not cover the land and the non-flat part, wherein the connection portion includes a remaining part, and a thickness of the non-flat part is different from a thickness of the remaining part.
2 more elements
A device comprising:
- a substrate including a first surface and a second surface opposite to the first surface;
- a semiconductor chip mounted over the first surface of the substrate;
- a land provided over the second surface of the substrate;
- a wiring line provided over the second surface of the substrate and arranged adjacent to the land, the wiring line being electrically coupled to the semiconductor chip;
- a connection portion electrically coupling the land to the wiring line, the connection portion including a non-flat part;
- a solder resist provided over the second surface of the substrate and the wiring line, and does not cover the land and the non-flat part;
- and a contact member mounted on the land and the non-flat part, wherein the connection portion includes a remaining part, and a thickness of the non-flat part is different from a thickness of the remaining part.
4 more elements
A device comprising:
- a first substrate including a first surface;
- a first land provided over the first surface of the first substrate;
- a first wiring line provided over the first surface of the first substrate and arranged adjacent to the first land;
- a first connection portion electrically coupling the first land to the first wiring line;
- a second substrate stacked over the first surface of the first substrate, the second substrate including a second surface that faces the first surface of the first substrate;
- a second land provided over the second surface of the second substrate;
- a second wiring line provided over the second surface of the second substrate and arranged adjacent to the second land;
- a second connection portion electrically coupling the second land to the second wiring line, the second connection portion including a first non-flat part;
- a first solder resist provided over the second surface of the second substrate and the second wiring line, and does not cover the second land and the first non-flat part;
- and a contact member mounting on the first and second lands and covering the first and second lands and the first non-flat part, wherein the second connection portion includes a remaining part, and a thickness of the first non-flat part is different from a thickness of the remaining part.
7 more elements
Dependencies are inferred from the claim text.