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US 8,507,801 B2Granted
Printed wiring board
AssigneeShin-Etsu Polymer Co., Ltd.
InventorsToshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
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Abstract
A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.
Claims6
A printed wiring board comprising:
- a printed wiring board body composed of a substrate and a conductive layer formed on a surface of the substrate;
- a coverlay film comprising a coverlay film body and a resistance layer formed on a surface of the coverlay film body,
- wherein:
- the printed wiring board body and the coverlay film body are adhered by an adhesive layer, and
- wherein the resistance layer is separated from and opposed to the conductive layer by the adhesive layer.
2 more elements
Dependencies are inferred from the claim text.