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AssigneeHitachi Cable, Ltd.
InventorsSatoru Amou, Kosuke Kuwabara, Tomiya Abe, Hiroaki Komatsu, Kenichi Murakami
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An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films.
An adhesive composition comprising a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin, wherein the maleimide compound has a plurality of maleimide groups in a structure and is at least one member selected from the group consisting of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds.
An adhesive film comprising an adhesive layer formed on a substrate made of a polyimide, the adhesive layer comprising a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin, the maleimide compound having a plurality of maleimide groups in the structure being at least one member selected from the group consisting of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds.
A wiring film comprising conductor wirings disposed on an adhesive layer of a first adhesive film on a substrate made of a polyimide, the adhesive layer of the first adhesive film comprising a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin in which the maleimide compound has a plurality of maleimide groups in a structure and is at least one member selected from the group consisting of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds, and an adhesive layer of a second adhesive film further stacked on the conductor wirings, the first and the second adhesive films being fusion bonded to each other, and the first adhesive film and the second adhesive film being fusion bonded with the conductor wirings.
Dependencies are inferred from the claim text.