Laser and plasma etch wafer dicing using water-soluble die attach film

A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:

• forming a mask above a silicon substrate disposed on a water-soluble die attach film, the mask covering and protecting integrated circuits disposed on the silicon substrate, the integrated circuits comprising a layer of silicon dioxide disposed above a layer of low K material and a layer of copper;
• patterning the mask, the layer of silicon dioxide, the layer of low K material, and the layer of copper with a laser scribing process to expose regions of the silicon substrate between the integrated circuits;
• etching the silicon substrate through the exposed regions to form singulated integrated circuits and stopping on the water-soluble die attach film;
• and
• patterning the water-soluble die attach film with an aqueous solution between the singulated integrated circuits.