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US 8,507,360 B2Granted
Transfer method of functional region, LED array, LED printer head, and LED printer
AssigneeCanon Kabushiki Kaisha
InventorsTakao Yonehara, Yasuyoshi Takai
Life of this patent
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Abstract
A method includes arranging a bonding layer of a predetermined thickness on at least one of a first functional region bonded on a release layer, which is capable of falling into a releasable condition when subjected to a process, on a first substrate, and a region, to which the first functional region is to be transferred, on a second substrate; bonding the first functional region to the second substrate through the bonding layer; and separating the first substrate from the first functional region at the release layer.
Claims14
A method comprising:
- arranging a first bonding layer of a first predetermined thickness at a region on a second substrate to which a first functional region bonded on a release layer on a first substrate is to be transferred, the release layer being capable of falling into a releasable condition when subjected to a process;
- bonding the first functional region to the second substrate through the first bonding layer;
- separating the first substrate from the first functional region at the release layer;
- forming a predetermined unevenness on a region on the second substrate, other than the region to which the first functional region is to be transferred, and
- wherein plural functional regions, including the first and a second functional regions, are bonded on the release layer on the first substrate, and the unevenness is formed on a region on the second substrate, corresponding to the second functional region remaining on the first substrate.
2 more elements
A method comprising:
- arranging a first bonding layer of a first predetermined thickness at a region on a second substrate to which a first functional region bonded on a release layer on a first substrate is to be transferred, the release layer being capable of falling into a releasable condition when subjected to a process;
- bonding the first functional region to the second substrate through the first bonding layer;
- separating the first substrate from the first functional region at the release layer;
- forming a predetermined unevenness on a region on the second substrate, other than the region to which the first functional region is to be transferred, and
- wherein the release layer includes a material subject to decomposition or decrease in bonding strength by heating or cooling, and the separating the first substrate includes heating or cooling the release layer.
2 more elements
Dependencies are inferred from the claim text.