Semiconductor device and manufacturing method thereof
AssigneeNissan Motor Co., Ltd.
InventorsTetsuya Hayashi, Hideaki Tanaka, Masakatsu Hoshi, Saichirou Kaneko
Life of this patent
Estimating the term…
Loading patent…
AssigneeNissan Motor Co., Ltd.
InventorsTetsuya Hayashi, Hideaki Tanaka, Masakatsu Hoshi, Saichirou Kaneko
Estimating the term…
An aspect of the present invention provides a semiconductor device that includes a first conductivity type semiconductor body, a source region in contact with the semiconductor body, whose bandgap is different from that of the semiconductor body, and which formed heterojunction with the semiconductor body, a gate insulating film in contact with a portion of junction between the source region and the semiconductor body, a gate electrode in contact with the gate insulating film, a source electrode, a low resistance region in contact with the source electrode and the source region, and connected ohmically with the source electrode, and a drain electrode connected ohmically with the semiconductor body.
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.