US 8,507,332 B2 · Method for manufacturing components

Abstract

A method for manufacturing components on a mixed substrate. The method comprises the following steps: providing a substrate of the semiconductor-on-insulator (SeOI) type comprising a buried oxide layer between a supporting substrate and a thin layer, forming in this substrate a plurality of trenches opening out at a free surface of the thin layer and extending over a depth such that each trench passes through the thin layer and the buried oxide layer, these primary trenches delimiting at least one island of the SeOI substrate, forming a mask inside the primary trenches and as a layer covering the areas of the free surface of the thin layer located outside the islands, proceeding with heat treatment for dissolving the buried oxide layer present at the island, so as to reduce the thickness thereof.

Claims24

Dependent claims

A method for manufacturing at least one of an electronic device, an optical device, and an optoelectronic device, comprising:

forming a plurality of trenches extending through a thin semiconductor layer and a buried insulator layer of a semiconductor-on-insulator substrate and delimiting at least one island comprising a portion of the thin semiconductor layer and a portion of the buried insulator layer;
forming a dissolution mask comprising a material deposited within the plurality of trenches and covering at least one area of a free surface of the thin semiconductor layer outside the at least one island;
and
subjecting the semiconductor-on-insulator substrate to a heat treatment to at least partially dissolve the portion of the buried insulator layer in the at least one island and reduce a thickness of the buried insulator layer in the at least one island.

1 more element

Dependencies are inferred from the claim text.

Method for manufacturing components

Life of this patent

Method for manufacturing components

Life of this patent

Abstract

Claims24