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US 8,507,324 B2Granted
Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
AssigneeIntel Corporation
InventorsRavi K Nalla, Drew W Delaney
Life of this patent
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a cavity in a carrier material, attaching a die in the cavity, wherein a backside of the die comprises a metal filled DBF, forming a dielectric material adjacent the die and on a bottom side of the carrier material, forming a coreless substrate by building up layers on the dielectric material, and removing the carrier material from the coreless substrate.
Claims13
A method comprising;
- forming a cavity in a carrier material, wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer;
- attaching a die in the cavity, wherein a backside of the die comprises a die backside film (“DBF”);
- forming Package-on-Package (“PoP”) lands on the bottom layer of the carrier material adjacent the die;
- forming a dielectric material adjacent the die and on the carrier material bottom layer;
- forming a coreless substrate by building up layers on the dielectric material;
- and
- removing the carrier material top and bottom layers and etch stop layer from the coreless substrate.
4 more elements
A method comprising;
- forming a cavity in a carrier material;
- attaching a die in the cavity, wherein a backside of the die comprises a metal filled die backside film (“DBF”);
- forming Package-on-Package (“PoP”) land structures on the bottom layer of the carrier material adjacent the die;
- forming a dielectric material adjacent the die and on a bottom side of the carrier material;
- forming a coreless substrate by building up layers on the dielectric material, wherein vias are formed to connect with the PoP land structures;
- and
- removing the carrier material from the coreless substrate.
4 more elements
Dependencies are inferred from the claim text.