Method of producing semiconductor device with patterned photosensitive adhesive
AssigneeHitachi Chemical Company, Ltd.
InventorsTakashi Masuko, Takashi Kawamori, Kazuyuki Mitsukura, Shigeki Katogi
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Abstract
A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.
Claims9
A method for producing a semiconductor device comprising the steps of:
- (a) patterning a photosensitive adhesive provided on a circuit surface of a first semiconductor chip by light exposure and development;
- and
- (b) directly bonding a second semiconductor chip to the patterned photosensitive adhesive, wherein
- the photosensitive adhesive is capable of alkali development and exhibits an adhesion property for an adherend after the photosensitive adhesive has been patterned by light exposure and development.
Dependencies are inferred from the claim text.