Integrated circuit package system with shield
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Byung Tai Do, Heap Hoe Kuan, Rui Huang
Life of this patent
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Abstract
An integrated circuit package system includes: forming a first lead and a second lead; connecting an integrated circuit die with the first lead; forming an encapsulation over the integrated circuit die, the first lead, and the second lead with a portion of a top side of the second lead exposed; and forming a shield over the encapsulation, the first lead, and the second lead with the shield not in contact with the first lead.
Claims20
A method of manufacturing an integrated circuit package system comprising:
- forming a first lead;
- forming a second lead, the second lead having an outer end and a top portion, the top portion adjacent to the first lead;
- connecting an integrated circuit die to the first lead;
- forming an encapsulation on the integrated circuit die, the first lead, and the second lead, the encapsulation having a planar sidewall;
- and
- forming a shield over the top surface of the encapsulation, the shield isolated from the first lead by the encapsulation, the shield being directly formed on the top portion of the second lead, and wherein the shield includes an outer edge facing away from the integrated circuit die, the outer edge of the shield being coplanar with the outer end of the second lead and the planar sidewall of the encapsulation.
A method of manufacturing an integrated circuit package system comprising:
- forming a first lead;
- forming a second lead, the second lead having an outer end and a top portion, the top portion adjacent to the first lead;
- connecting an integrated circuit die to the first lead;
- forming an encapsulation on the integrated circuit die, the first lead, and the second lead, the encapsulation having a planar sidewall;
- forming a shield over top surface of the encapsulation, the shield isolated from the first lead by the encapsulation, the shield being directly formed on the top portion of the second lead, and wherein the shield includes an outer edge facing away from the integrated circuit die, the outer edge of the shield being coplanar with the outer end of the second lead and the planar sidewall of the encapsulation;
- and
- connecting the shield to a reference level coupled with the second lead.
An integrated circuit package system comprising:
- a first lead;
- a second lead, the second lead having an outer end and a top portion, the top portion adjacent to the first lead;
- an integrated circuit die connected to the first lead;
- an encapsulation on the integrated circuit die, the first lead, and the second lead, the encapsulation having a planar sidewall;
- and
- a shield over the top surface of the encapsulation, the shield isolated from the first lead by the encapsulation, the shield being directly formed on the top portion of the second lead, and wherein the shield includes an outer edge facing away from the integrated circuit die, the outer edge of the shield being coplanar with the outer end of the second lead and the planar sidewall of the encapsulation.
Dependencies are inferred from the claim text.