Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same

An imaging apparatus manufacturing method, the method comprising:

• providing a protective tape on a surface of a sealing film formed on a first surface of a semiconductor substrate of a photosensor;
• providing a visible light transmitting plate on a second surface of the semiconductor substrate;
• disposing a lens unit on the visible light transmitting plate;
• and
• removing the protective tape after the lens unit is disposed;
• wherein the photosensor comprises, on the first surface of the semiconductor substrate:
• a photoelectric conversion device region and a connection pad;
• an insulating film;
• a wiring line which is provided on a lower surface of the insulating film to be connected to the connection pad and which includes a land as an external connection electrode;
• and
• the sealing film, the sealing film being provided in a region under the insulating film including the wiring line except for a land of the wiring line;
• and
• wherein a total thickness of the semiconductor substrate and the sealing film is 350 μm or less.