Semiconductor device and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising:

• forming a plurality of semiconductor integrated circuit portions including photoelectric conversion elements over each of second surfaces of a first light-transmitting substrate, a second light-transmitting substrate, and a third light-transmitting substrate;
• reducing a thickness of each of the first light-transmitting substrate, the second light-transmitting substrate, and the third light-transmitting substrate;
• forming a groove on each of first surfaces of the first light-transmitting substrate, the second light-transmitting substrate, and the third light-transmitting substrate, the groove being overlapped with a portion between the plurality of semiconductor integrated circuit portions;
• forming a first chromatic color light-transmitting resin layer, a second chromatic color light-transmitting resin layer, and a third chromatic color light-transmitting resin layer over first surfaces of the first light-transmitting substrate, the second light-transmitting substrate, and the third light-transmitting substrate in each of which the groove is formed, respectively;
• cutting the first chromatic color light-transmitting resin layer and the first light-transmitting substrate along the groove of the first light-transmitting substrate, the second chromatic color light-transmitting resin layer and the second light-transmitting substrate along the groove of the second light-transmitting substrate, and the third chromatic color light-transmitting resin layer and the third light-transmitting substrate along the groove of the third light-transmitting substrate to form a first semiconductor integrated circuit, a second semiconductor integrated circuit, and a third semiconductor integrated circuit;
• providing the first semiconductor integrated circuit, the second semiconductor integrated circuit, and the third semiconductor integrated circuit into openings in a structure body in which a fibrous body is impregnated with an organic resin;
• and
• bonding the first semiconductor integrated circuit, the second semiconductor integrated circuit, and the third semiconductor integrated circuit to the structure body in which the fibrous body is impregnated with the organic resin,
• wherein the first chromatic color light-transmitting resin layer, the second chromatic color light-transmitting resin layer, and the third chromatic color light-transmitting resin layer include different coloring materials.

A method for manufacturing a semiconductor device, comprising:

• forming an amorphous semiconductor film over a first light-transmitting substrate, a second light-transmitting substrate and a third light-transmitting substrate;
• adding an element promoting crystallization into the amorphous semiconductor film;
• heating the amorphous semiconductor film;
• forming a first semiconductor integrated circuit including a first chromatic color light-transmitting resin layer and a first photoelectric conversion element over the first light-transmitting substrate;
• forming a second semiconductor integrated circuit including a second chromatic color light-transmitting resin layer and a second photoelectric conversion element over the second light-transmitting substrate;
• forming a third semiconductor integrated circuit including a third chromatic color light-transmitting resin layer and a third photoelectric conversion element over the third light-transmitting substrate;
• cutting out the first semiconductor integrated circuit from the first light-transmitting substrate;
• cutting out the second semiconductor integrated circuit from the second light-transmitting substrate;
• cutting out the third semiconductor integrated circuit from the third light-transmitting substrate;
• providing the first semiconductor integrated circuit, the second semiconductor integrated circuit, and the third semiconductor integrated circuit into openings in a structure body in which a fibrous body is impregnated with an organic resin;
• and
• bonding the first semiconductor integrated circuit, the second semiconductor integrated circuit, and the third semiconductor integrated circuit to the structure body in which the fibrous body is impregnated with the organic resin,
• wherein the first chromatic color light-transmitting resin layer, the second chromatic color light-transmitting resin layer, and the third chromatic color light-transmitting resin layer include different coloring materials.

A method for manufacturing a semiconductor device, comprising:

• forming an amorphous semiconductor film over a first light-transmitting substrate, a second light-transmitting substrate and a third light-transmitting substrate;
• adding an element promoting crystallization into the amorphous semiconductor film;
• heating the amorphous semiconductor film and forming a polycrystalline silicon film;
• forming a first semiconductor integrated circuit including a first chromatic color light-transmitting resin layer and a first photoelectric conversion element over the first light-transmitting substrate;
• forming a second semiconductor integrated circuit including a second chromatic color light-transmitting resin layer and a second photoelectric conversion element over the second light-transmitting substrate;
• forming a third semiconductor integrated circuit including a third chromatic color light-transmitting resin layer and a third photoelectric conversion element over the third light-transmitting substrate;
• cutting out the first semiconductor integrated circuit from the first light-transmitting substrate;
• cutting out the second semiconductor integrated circuit from the second light-transmitting substrate;
• cutting out the third semiconductor integrated circuit from the third light-transmitting substrate;
• providing the first semiconductor integrated circuit, the second semiconductor integrated circuit, and the third semiconductor integrated circuit into openings in a structure body in which a fibrous body is impregnated with an organic resin;
• and
• bonding the first semiconductor integrated circuit, the second semiconductor integrated circuit, and the third semiconductor integrated circuit to the structure body in which the fibrous body is impregnated with the organic resin,
• wherein the first chromatic color light-transmitting resin layer, the second chromatic color light-transmitting resin layer, and the third chromatic color light-transmitting resin layer include different coloring materials.