Packaging and testing of multiple MEMS devices on a wafer
AssigneeSpatial Photonics, Inc.
InventorsShaoher X. Pan, Vlad Novotny
Life of this patent
Estimating the term…
Abstract
A wafer containing a plurality of electro-optical devices, each device being enclosed in chamber that has a translucent cover. An X-Y matrix of pairs of interconnections on the wafer are connected to the circuitry of the electro-optical devices for addressing the electro-optical devices. The pairs of interconnections extend outside of the chambers enclosing the devices to testing areas on the periphery of the wafer. Testing is done by signals applied through the interconnections while simultaneously exposing the devices to light through the translucent covers.
Claims12
A method for testing a plurality of encapsulated electro-optical devices on a semiconductor wafer, comprising:
- applying an electric signal through a pair of interconnections, selected from an X-Y matrix of interconnections on the wafer, from electrical terminals located at the periphery of the semiconductor wafer to an electro-optical device associated with the selected pair of interconnections, the electro-optical device being encapsulated at least partially with a translucent material in a chamber on the wafer;
- while the electric signal is present, passing light through the translucent material of the chamber encapsulating the associated electro-optical device, thereby illuminating the associated electro-optical device, the device transmitting or reflecting light from the illumination to form a light beam that can be detected.
A method for testing a plurality of encapsulated electro-optical devices on a semiconductor wafer, comprising:
- transmitting a plurality electric signals through a plurality of pairs of interconnections selected from an X-Y matrix of interconnections on the wafer, from electrical terminals located on the periphery of the semiconductor wafer to electro-optical devices associated with the plurality of pairs of interconnections, the plurality of electro-optical devices being encapsulated at least partially with a translucent material in a plurality of chambers on the wafer;
- while the electric signals are present, illuminating the electro-optical devices through the translucent material of the chambers encapsulating the associated electro-optical devices, thereby illuminating the associated electro-optical devices, the electro-optical devices reflecting or transmitting light from the illumination to form a light beam that can be detected as a measure of the functionality of the devices.
Dependencies are inferred from the claim text.