Positive resist composition, pattern forming method using the composition, and compound for use in the composition
AssigneeFUJIFILM Corporation
InventorsHidenori Takahashi, Kenji Wada, Sou Kamimura
Life of this patent
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AssigneeFUJIFILM Corporation
InventorsHidenori Takahashi, Kenji Wada, Sou Kamimura
Estimating the term…
A positive resist composition comprising (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (B) a resin capable of increasing the solubility in an alkali developer by the action of an acid, and (C) a compound having a specific structure, which decomposes by the action of an acid to generate an acid, a pattern forming method using the positive resist composition, and a compound for use in the positive resist composition are provided as a positive resist composition exhibiting good performance in terms of pattern profile, line edge roughness, pattern collapse, sensitivity and resolution in normal exposure (dry exposure), immersion exposure and double exposure, a pattern forming method using the positive resist composition and a compound for use in the positive resist composition.
A positive resist composition, comprising:
A positive resist composition, comprising:
A compound represented by the following:
Dependencies are inferred from the claim text.