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US 8,507,172 B2Granted
Positive resist composition and pattern forming method using the positive resist composition
AssigneeFUJIFILM Corporation
InventorKenji Wada
Life of this patent
Estimating the term…
Abstract
A positive resist composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under action of an acid; and (C) a compound capable of decomposing under action of an acid to generate an acid.
Claims9
A positive resist composition comprising:
- (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation;
- (B) a resin of which solubility in an alkali developer increases under action of an acid;
- (C) a compound capable of decomposing under action of an acid to generate an acid;
- and
- (HR) a hydrophobic resin,
- wherein the pKa of the acid generated from the compound (C) is less than or equal to 3;
- and
- the resin (B) comprises at least one of a repeating unit represented by formula (Ia) and a repeating unit represented by formula (Ib):
- wherein Xa1 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom;
- Ry1 to Ry3 each independently represents an alkyl group or a cycloalkyl group, and at least two members out of Ry1 to Ry3 may combine to form a monocyclic or polycyclic cyclohydrocarbon structure;
- Z represents an (n+1)-valent linking group;
- Ry4 represents a hydrogen atom, an alkyl group or a cycloalkyl group and Ry5 represents an alkyl group or a cycloalkyl group, and Ry4 and Ry5 may combine to form a monocyclic or polycyclic cyclohydrocarbon structure;
- L1 represents an (n+1)-valent linking group;
- and
- n represents an integer of 1 to 3.
12 more elements
A pattern forming method comprising:
- forming a resist film from a positive resist composition;
- forming a hydrophobic resin-containing topcoat on the resist film;
- and
- subjecting the resist film to immersion exposure and development,
- wherein the positive resist composition comprises:
- (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation;
- (B) a resin of which solubility in an alkali developer increases under action of an acid;
- and
- (C) a compound capable of decomposing under action of an acid to generate an Acid,
- wherein the pKa of the acid generated from the compound (C) is less than or equal to 3;
- and
- the resin (B) comprises at least one of a repeating unit represented by formula (Ia) and a repeating unit represented by formula (Ib):
- wherein Xa1 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom;
- Ry1 to Ry3 each independently represents an alkyl group or a cycloalkyl group, and at least two members out of Ry1 to Ry3 may combine to form a monocyclic or polycyclic cyclohydrocarbon structure;
- Z represents an (n+1)-valent linking group;
- Ry4 represents a hydrogen atom, an alkyl group or a cycloalkyl group and Ry5 represents an alkyl group or a cycloalkyl group, and Ry4 and Ry5 may combine to form a monocyclic or polycyclic cyclohydrocarbon structure;
- L1 represents an (n+1)-valent linking group;
- and
- n represents an integer of 1 to 3.
16 more elements
Dependencies are inferred from the claim text.