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US 8,507,107 B2Granted
Electronic device housing and method for making the same
AssigneesShenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
InventorsQi-Jian Du, Chwan-Hwa Chiang
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Abstract
An electronic device housing is provided. The electronic device housing includes a substrate, a first metallic coating formed on the substrate, and a second metallic coating formed on a portion of the first metallic coating. The first and second metallic coatings are formed by vacuum sputtering or vacuum vapor deposition. The first and second metallic coatings are all non-conductive. A method for making the electronic device housing is also described there.
Claims16
An electronic device housing, comprising:
- a substrate;
- a plurality of first metallic coatings formed on the substrate by vacuum sputtering or vacuum vapor deposition, the first metallic coatings comprising a plurality of niobium pentoxide layers interleaved with a plurality of silicon dioxide layers;
- and
- a plurality of second metallic coatings formed on a portion surface of the first metallic coatings by vacuum sputtering or vacuum vapor deposition, the second metallic coatings comprising a plurality of niobium pentoxide layers interleaved with a plurality of silicon dioxide layers;
- wherein the regions of the second metallic coatings present changing and shifting color patterns or letters when viewed during a movement of the electronic device housing relative to a viewer.
2 more elements
Dependencies are inferred from the claim text.