Intermetallic bonded diamond composite composition and methods of forming articles from same
AssigneeBoard of Trustees at Southern Illinois University
InventorsDale E. Wittmer, Peter Filip
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AssigneeBoard of Trustees at Southern Illinois University
InventorsDale E. Wittmer, Peter Filip
Estimating the term…
An intermetallic bonded diamond composite composition and methods of processing such a composition are provided by the present invention. The intermetallic bonded diamond composite composition preferably comprises a nickel aluminide (Ni3Al) binder and diamond particles dispersed within the nickel aluminide (Ni3Al) binder. Additionally, the composite composition has a processing temperature of at least about 1,200° C. and is processed such that the diamond particles remain intact and are not converted to graphite or vaporized by the high-temperature process. Methods of forming the composite composition are also provided that generally comprise the steps of milling, pressing, and sintering the high-temperature intermetallic binder and diamond particles.
An intermetallic bonded diamond composite composition comprising a nickel aluminide (Ni3Al) binder and diamond particles which are dispersed within the nickel aluminide (Ni3Al) binder, wherein the diamond particles consist of a size greater than 10 microns up to about 700 microns.
An intermetallic bonded diamond composite composition comprising a high-temperature intermetallic binder and diamond particles dispersed within the high-temperature intermetallic binder, wherein the high-temperature intermetallic binder has a processing temperature of at least about 1,200° C., and a coefficient of thermal expansion that is substantially different from the coefficient of thermal expansion for the diamond particles, which provides for contraction of the binder surrounding the diamond particles, and wherein the diamond particles consist of intact diamond particles having a size greater than 10 microns up to about 700 microns.
An intermetallic bonded diamond composite comprising a high-temperature intermetallic binder and diamond particles consisting of intact diamond particles having a size greater than 10 microns up to about 700 microns, the composite formed by a process of:
An intermetallic bonded diamond composite comprising diamond particles consisting of intact diamond particles having a size greater than 10 microns up to about 700 microns, disposed within a nickel aluminide (Ni3Al) binder, the diamond particles and the binder each defining a coefficient of thermal expansion, wherein the nickel aluminide (Ni3Al) binder has coefficient of thermal expansion that is substantially different from the coefficient of thermal expansion of the diamond particles, which provides for contraction of the binder surrounding the diamond particles.
An intermetallic composite composition comprising diamond particles consisting of a size greater than 10 microns up to about 700 microns, the intermetallic composite composition being formed using a high-temperature intermetallic binder having a coefficient of thermal expansion that is substantially greater than the coefficient of thermal expansion of the diamond particles, by a high-temperature process having temperatures of at least about 1,200° C., wherein the substantially greater coefficient of thermal expansion of the binder provides for contraction of the binder surrounding the diamond particles, such that the diamond particles remain intact and are not converted to graphite or vaporized by the high-temperature process.
Dependencies are inferred from the claim text.