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US 8,506,832 B2Granted
Wafer dividing apparatus and methods
AssigneeSamsung Electronics Co., Ltd.
InventorsHotae Jin, Seonju Oh, HeuiSeog Kim
Life of this patent
Estimating the term…
Abstract
Example embodiments are directed to a wafer dividing apparatus and method thereof. The wafer dividing apparatus includes a chuck unit having upper and lower chucks, a cutting wire that is provided in a space between the upper and lower chucks to cut a wafer and driven by a first driving unit, and an etchant supplying nozzle supplying etchant to a groove of the wafer, which is formed by the cutting wire.
Claims16
A wafer dividing method comprising:
- providing a chuck unit having upper and lower chucks;
- loading a wafer between the lower and upper chucks;
- cutting the wafer from an edge thereof by inserting a cutting wire in a space between the lower and upper chucks;
- and
- supplying an etchant to a groove of the wafer, the groove being formed by the cutting wire, wherein the upper chuck covers an upper sidewall of the wafer and the lower chuck covers a lower sidewall of the wafer.
2 more elements
A wafer dividing method comprising:
- providing a chuck unit having upper and lower chucks;
- loading a wafer between the lower and upper chucks;
- cutting the wafer from an edge thereof by inserting a cutting wire in a space between the lower and upper chucks;
- supplying an etchant to a groove of the wafer, the groove being formed by the cutting wire;
- and
- maintaining the wafer at a temperature between 50 and 100° C.
3 more elements
Dependencies are inferred from the claim text.