Capacitive coupling plasma processing apparatus and method for using the same

A plasma processing apparatus comprising:

• a process container configured to accommodate a target substrate and to be vacuum-exhausted;
• a first electrode and a second electrode disposed opposite each other within the process container, the first electrode being an upper electrode and the second electrode being a lower electrode configured to have the target substrate disposed thereon, the first electrode including an outer electrode portion and an inner electrode portion both facing the second electrode such that the outer electrode portion surrounds the inner electrode portion and is decoupled for direct current (DC) relative to the inner electrode portion;
• a first radio frequency (RF) power supply configured to apply a first RF power for plasma generation to the outer and inner electrode portions of the first electrode;
• a DC power supply configured to apply a DC voltage to the outer and inner electrode portions of the first electrode;
• a first switch and a second switch respectively interposed between the outer and inner electrode portions of the first electrode and the DC power supply and configured to turn on and off application of the DC voltage to the outer and inner electrode portions independently from each other;
• a process gas supply system including gas delivery holes formed in the inner electrode portion of the first electrode and facing the second electrode and a process gas supply unit configured to supply a process gas into the process container through the gas delivery holes, plasma of the process gas being generated between the first electrode and the second electrode;
• and
• a control section configured to control an operation of the apparatus and including a non-transitory storage medium that stores a program for execution on a computer to control the apparatus, which when executed, control the apparatus to perform a plasma processing while setting distribution of the plasma generated between the first electrode and the second electrode by application of the first RF power and the DC voltage by use of the first RF power supply, the DC power supply, and the first and second switches.