Polishing apparatus and polishing method

A polishing apparatus comprising:

• a substrate holder configured to hold and rotate a substrate;
• a press pad configured to press a belt-shaped polishing tool having a polishing surface against a bevel portion of the substrate held by said substrate holder;
• and
• a feeding mechanism configured to cause the belt-shaped polishing tool to travel in its longitudinal direction,
• wherein said press pad includes
• a hard member having a pressing surface for pressing the belt-shaped polishing tool against the bevel portion of the substrate, said hard member being bendable in its entirety along a circumferential direction of the substrate, and
• at least one elastic member for pressing said hard member to press the belt-shaped polishing tool against the bevel portion of the substrate so as to bend said hard member in its entirety along the circumferential direction of the substrate.