Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
AssigneeJsr Corporation
InventorsHirotaka Shida, Takafumi Shimizu, Masatoshi Ikeda, Shou Kubouchi, Yousuke Shibata, Kazuhito Uchikura, Akihiro Takemura
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Abstract
A chemical mechanical polishing aqueous dispersion including (A) silica particles, and (B1) an organic acid, the sodium content, the potassium content, and the ammonium ion content of the silica particles (A) determined by ICP atomic emission spectrometry, ICP mass spectrometry, or ammonium ion quantitative analysis using ion chromatography having a relationship in which the sodium content is 5 to 500 ppm and at least one of the potassium content and the ammonium ion content is 100 to 20,000 ppm.
Claims29
A chemical mechanical polishing aqueous dispersion comprising silica particles (A), and an organic acid (B1),
- wherein sodium content, potassium content, and ammonium ion content of the silica particles (A), as determined by ICP atomic emission spectrometry, ICP mass spectrometry, or ammonium ion quantitative analysis with ion chromatography, have a relationship in which the sodium content is 5 to 500 ppm and at least one of the potassium content and the ammonium ion content is 100 to 20,000 ppm.
A chemical mechanical polishing aqueous dispersion comprising silica particles (A), and an amino acid (B2),
- wherein sodium content, potassium content, and ammonium ion content of the silica particles (A), as determined by ICP atomic emission spectrometry, ICP mass spectrometry, or ammonium ion quantitative analysis with ion chromatography, have a relationship in which the sodium content is 5 to 500 ppm and at least one of the potassium content and the ammonium ion content is 100 to 20,000 ppm.
Dependencies are inferred from the claim text.