System and method for in-situ inspection during metallurgical cross-sectioning

A polishing device with an in-situ optical inspection system, the polishing device comprising:

• a base;
• an arm mounted on a top surface of the base, wherein the arm is moveable in a horizontal plane;
• a spindle moveable in a vertical plane, wherein the spindle has a proximal end extending from the arm and a distal end;
• a spindle bit attached to the distal end of the spindle configured to hold a metallurgical sample;
• a rotatable wheel underlying the spindle bit having an inner diameter between a center of the rotatable wheel and an inner circumference, wherein the rotatable wheel has a top surface configured to accept a polishing compound, and a transparent outer diameter between the inner circumference and an outer edge of the rotatable wheel;
• and
• an optical system underlying the outer diameter of a bottom surface of the rotatable wheel, wherein the optical system is configured to view images of the metallurgical sample;
• wherein the arm and the spindle cooperate to move the metallurgical sample, in the horizontal plane, between a first position overlying the inner diameter of the rotatable wheel for polishing, and a second position overlying the outer diameter of the rotatable wheel for in-situ inspection by the optical system.