US 8,506,335 B2Granted

Apparatus for testing electronic devices

AssigneeAEHA Test Systems

InventorsDonald P. Richmond, II, Kenneth W. Deboe, Frank O. Uher, Jovan Jovanovic, Scott E. Lindsey, Thomas T. Maenner, Patrick M. Shepherd, Jeffrey L. Tyson, Mark C. Carbone, Paul W. Burke, Doan D. Cao, James F. Tomic, Long V. Vu

Life of this patent

Estimating the term…

patentgrep

Loading patent…

Abstract

An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Claims6

Dependent claims

An apparatus for testing an integrated circuit of a device, comprising:

an apparatus frame having first, second, and third portions;
a holder for the device mounted to the first portion of the apparatus frame;
a plurality of first connector modules held by the second portion of the apparatus frame, each having a body and a plurality of terminals and contacts on the body;
a contactor support structure;
a plurality of terminals on the contactor support structure, the contactor support structure being positioned so that the terminals thereon can make contact with contacts on the device;
a plurality of conductors connecting the terminals on the contactor support structure with the terminals of the first connector modules;
and
a plurality of second connector modules held by the third portion of the apparatus frame, each having a body and a plurality of terminals and contacts on the body, the contacts of the first connector modules being engageable with the terminals of the second connector modules.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/754,765Filed 30 Jan 2013 · division
Priority: 27 Apr 2005
Published: US 2013/0141135 A16 Jun 2013
Granted: 13 Aug 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

G01R 31/287
Complete testing stations; systems; procedures; software aspects: procedures; Software aspects
G01R 31/003
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by…
G01R 31/26
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by…
G01R 31/2642
Testing of individual semiconductor devices: testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests

Family

Application60/675,546Us provisional application · filed 27 Apr 2005
Application60/682,989Us provisional application · filed 19 May 2005
Application60/687,502Us provisional application · filed 3 Jun 2005
Application11/413,323Parent of this division · filed 27 Apr 2006
US 2013/0141135 A1Pre-grant publication · published 6 Jun 2013
US 7,762,822 B2Parent of this division
US 2007/0001790 A1Published application
US 8,506,335 B2This patent

From the US filing history. Foreign family members aren’t listed.