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US 8,506,055 B2Granted
MEMS integrated circuit having backside integrated circuit contacts
AssigneeZamtec Ltd
InventorsGregory John McAvoy, Rónán Pádraig Seán O'Reilly, David McLeod Johnstone, Kia Silverbrook
Life of this patent
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Abstract
A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.
Claims16
A MEMS integrated circuit comprising:
- a substrate having a frontside and a backside, said frontside comprising a drive circuitry layer;
- a MEMS layer disposed on said drive circuitry layer, said MEMS layer comprising a plurality of MEMS devices electrically connected to said drive circuitry layer;
- and
- one or more integrated circuit contacts positioned at said backside of said substrate, wherein said integrated circuit contacts are electrically connected to said drive circuitry layer via respective connector rods extending through said substrate.
1 more element
Dependencies are inferred from the claim text.