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US 8,505,928 B2Granted
Substrate temperature control fixing apparatus
AssigneeShinko Electric Industries Co., Ltd.
InventorsMiki Saito, Tadayoshi Yoshikawa, Koki Tamagawa
Life of this patent
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Abstract
A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.
Claims7
A substrate temperature control fixing apparatus comprising:
- an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on an upper surface of the base body;
- a base plate which supports the electrostatic chuck;
- a bank portion provided on an outer periphery of an upper surface of the base plate which is opposed to a lower surface of the base body;
- and
- a heating unit provided on an inside of the bank portion, wherein
- a surface of the bank portion which is faced to the lower surface of the base body and the lower surface of the base body are fixed to each other through a first bonding layer,
- the heating unit is fixed to the lower surface of the base body through the first bonding layer, and
- the surface at the first bonding layer side of the heating unit and the surface at the first bonding layer side of the bank portion form a coplanar surface.
5 more elements
Dependencies are inferred from the claim text.