Layered composite for a card body and method for producing the layered composite

A method for producing a layered composite for a card body comprising at least one chip module for a chip card, wherein a substrate layer arrangement furnished with the chip module and made of a plastic material having a substantially rigid shape, on opposing sides thereof is respectively provided with at least one intermediate layer made of a plastic material having a substantially elastic shape, said method comprising:

• upon arrangement of at least one cover layer made of a plastic material having a substantially rigid shape on the intermediate layers, exposing said at least one cover layer to pressure and heat for producing a laminate structure, wherein the at least one cover layer and an adjacent intermediate layer are substantially transparent and a laser-radiation absorbing layer is disposed between the substrate layer arrangement facing towards the transparent cover layer and the intermediate layer.

A method for producing a layered composite for a card body comprising at least one chip module for a chip card, wherein a substrate layer arrangement furnished with the chip module and made of a plastic material having a substantially rigid shape, on opposing sides thereof is furnished with respectively one intermediate layer made of a plastic material having a substantially elastic shape, said method comprising:

• exposing said at least one intermediate layer to pressure and heat for producing the laminate structure;
• and
• applying a cover layer made of a plastic material having a substantially rigid shape to the intermediate layers with a coating made of an adhesive material being arranged intermediately, wherein at least one cover layer and an adjacent intermediate layer are substantially transparent and a laser-radiation absorbing layer is disposed between the substrate layer arrangement facing towards the transparent cover layer and the intermediate layer.

A method for producing a layered composite for a card body comprising at least one chip module for a chip card, wherein at least one intermediate layer made of a plastic material having a substantially elastic shape is applied to opposing sides of a substrate layer arrangement furnished with the chip module and made of a plastic material having a substantially rigid shape, with a coating made of an adhesive material being arranged intermediately, said method comprising:

• applying a cover layer made of a plastic material having a substantially rigid shape is subsequently applied to the intermediate layers, with a coating made of an adhesive material being arranged intermediately, wherein at least one cover layer and an adjacent intermediate layer are substantially transparent and a laser-radiation absorbing layer is disposed between the substrate layer arrangement facing towards the transparent cover layer and the intermediate layer.