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US 8,505,805 B2Granted
Systems and methods for platinum ball bonding
AssigneeHoneywell International Inc.
InventorMark Eskridge
Life of this patent
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Abstract
An annealed platinum free air ball is bonded to a first contact and to a second contact. The bonding work hardens the platinum so that a work hardened platinum ball is resistant to temperature induced creep.
Claims8
A method for bonding, the method comprising:
- forming an annealed platinum free air ball from a platinum metal;
- positioning the annealed platinum free air ball between a first contact and a second contact in a predefined position;
- and
- simultaneously applying at least a pressure to the annealed platinum free air ball, the first contact, and the second contact to bond the annealed platinum free air ball to the first contact and the second contact,
- wherein the applied pressure deforms the annealed platinum free air ball into a work hardened bump,
- wherein the first or second contacts are electrical contacts,
- wherein the annealed platinum free air ball is not deformed prior to the application of the pressure to the ball and the first and second contacts.
4 more elements
Dependencies are inferred from the claim text.