Structure and apparatus for cooling integrated circuits using copper microchannels
AssigneeInternational Business Machines Corporation
InventorsRaschid Jose Bezama, Evan George Colgan, Madhusudan K. Iyengar, John Harold Magerlein, Roger Ray Schmidt
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Abstract
A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
Claims6
A cooler having a unitary construction comprising:
- a channel portion comprising a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween;
- at least one tapered opening formed in a set of the plurality of fins which does not extend across all the fins;
- a manifold portion disposed on an edge portion of the base and covering the channel portion, the manifold portion comprising an inlet port and an outlet port which are in fluid connection with respective tapered inlet and outlet manifold channels, and distribution channels for flowing coolant from the inlet port through the microchannels and to the outlet port;
- and
- a separator sheet comprising at least two elongated openings disposed between the channel portion and the tapered inlet and outlet manifold channels of the manifold portion, wherein distribution channels of the manifold portion are located above an active cooled portion of the plurality of fins, and wherein inlet and outlet channels of the manifold portion are located above the separator sheet.
Dependencies are inferred from the claim text.