Back to results
US 8,505,613 B2Granted
Die having a via filled with a heat-dissipating material
AssigneeIntel Corporation
InventorsGregory M. Chrysler, James G. Maveety
Life of this patent
Estimating the term…
Abstract
A structure including a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot. The via is at least partially filled with a heat-dissipating material and is also capable of absorbing heat from the hot spot.
Claims6
A structure comprising:
- a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material;
- and
- the via being capable of absorbing heat from the hot spot.
Dependencies are inferred from the claim text.