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AssigneeViktor Maier
InventorsViktor Maier, Karola Maier, Mohamed Hassan, Alexander Kraus, Helmut Wenzel
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The invention relates to a method for producing a sensor system for monitoring elements (1), in particular supporting-structure elements, by measurement with at least one sensor (5) in thick-film technology, and with a line (8) for connection to a measurement system, wherein the at least one sensor (5) is comprised of at least one film of an electrically conductive paste (2), and wherein the paste (2) is baked. To create such a method, and such a sensor system, by means of which elements (1) that would not fit into a continuous furnace can be provided with sensors (5) using thick-film technology, it is provided that the at least one sensor (5) is arranged directly on the surface of the element (1) to be monitored by applying the at least one film of paste (2) directly to the surface of the element (1) to be monitored so as to form the at least one sensor (5), and optionally connection lines (8) and a field bus (6), and by baking the same directly on the element (1).
A method for producing a sensor system for monitoring elements by measurement with a plurality of sensors in thick-film technology, and with a line for connection to a measurement system, wherein each sensor comprises at least one film of an electrically conductive paste, and wherein the paste is baked, wherein several sensors are formed directly on the surface of the element to be monitored and interconnected via a field bus by applying the at least one film of paste directly to the surface of the element to be monitored so as to form each sensor, and by baking the same directly on the element.
A sensor system for monitoring elements by measuring with a plurality of sensors in thick-film technology, and with a line for connection to a measurement system, wherein each sensor comprises at least one film of a temperature-cured, electrically conductive paste, wherein several sensors are arranged directly on the surface of the element to be monitored and are interconnected via a field bus.
Dependencies are inferred from the claim text.