Land grid array interposer producing method

A method of producing a land grid array (LGA) interposer structure, comprising:

• mounting interposers on a first surface of an electrically insulting carrier plane, said interposers extending linearly along the carrier plane and extending outwardly from the carrier plane, and the interposers being constituted of a dielectric elastomeric material;
• arranging a plurality of electrically-conductive elements about the surface of said interposers and extending radially inwardly and downwardly from an uppermost end thereof into electrical contact with components located on a second surface, opposite to the first surface of said electrically insulating carrier plane;
• mounting said interposers on said second surface of said carrier plane and being identical to and in an inverted relationship with the interposers on said first surface of said carrier plane, said interposers comprising a linear bar mounted on said insulating carrier plane on first and second surfaces thereof;
• and
• forming a plurality of electrically-conductive strips extending from the uppermost end of the interposers on the first surface of said carrier plane to the lowermost of the interposers on the second surface of said carrier plane in mutually electrical connection through at least one electrically-conductive via formed in said insulating carrier plane.