Method for manufacturing an electronic assembly
AssigneeRobert Bosch GmbH
InventorsUlrich Schaaf, Andreas Kugler
Life of this patent
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Abstract
A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.
Claims14
A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted, the method comprising:
- structuring an electrically conductive layer of a conductive foil on a non-conductive layer to form the circuit trace structure;
- attaching at least one contact point to the at least one electronic component;
- pressing the at least one contact point through the non-conductive layer to electrically connect the at least one electronic component to the electrically conductive layer;
- and
- laminating another foil onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.
A method for manufacturing an electronic assembly, comprising:
- patterning a first electrically conductive layer on a first non-conductive layer and a second electrically conductive layer on a second non-conductive layer;
- attaching a first contact point to a first electronic component and a second contact point to a second electronic component;
- pressing the respective first and second contact points through the respective first and second non-conductive layers to electrically connect the first electronic component to the first electrically conductive layer through the first non-conductive layer and electrically connect the second electronic component to the second electrically conductive layer through the second non-conductive layer;
- and
- laminating the first non-conductive layer to the second non-conductive layer such that the first and the second electronic components are positioned between the first electrically conductive layer and the second electrically conductive layer.
Dependencies are inferred from the claim text.