Method of manufacturing inertial sensor

A method of manufacturing an inertial sensor, comprising:

• applying a polymer having characteristics of both photosensitivity and adhesion to a base substrate without step;
• patterning the polymer so as to form an opening part in the polymer;
• completing a cap by forming a cavity on the base substrate exposed from the opening part through an etching process in a thickness direction;
• and
• bonding the cap to a device substrate by using the polymer,
• wherein the polymer have characteristics of both photosensitivity and adhesion, so the polymer is used as an etching resist at the time of etching the base substrate at the step of completing the cap and is used as an adhesive layer that bonds the cap to the device substrate at the step of bonding the cap.