Apparatus for manufacturing backlight source
AssigneesInnocom Technology (Shenzhen) Co., Ltd., Chimei Innolux Corporation
InventorsGang-Tao Gu, Zhong-Hai Xiao, Min-Cheng Wang
Life of this patent
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Abstract
A manufacturing apparatus for a backlight unit includes a feed mechanism, a testing mechanism, and an attachment mechanism. The feed mechanism arranges a plurality of light-emitting diodes in a row. The testing mechanism tests the light-emitting diodes. The attachment mechanism positions the light-emitting diodes to a circuit board. The attachment mechanism comprises a support assembly and a laminating device, in which the support assembly receives the light-emitting diodes tested by the at least one testing unit, the support assembly is opposite to the circuit board, and the laminating device laminates the light-emitting diodes to the circuit board. A method for manufacturing the backlight unit is also provided.
Claims9
A manufacturing apparatus for manufacturing a backlight unit, comprising:
- a feed mechanism configured to arrange a plurality of light-emitting diodes in a row;
- a testing mechanism having a testing module and a disposal module, wherein the testing module is configured to test the function of the light-emitting diodes, wherein the disposal module is configured to discharge the light-emitting diodes that do not pass the test of the test module;
- a first feed rail connecting the feed mechanism and the testing mechanism, wherein the first feed rail is configured to transfer the light-emitting diodes from the feed mechanism to the testing mechanism;
- an attachment mechanism having a guiding feeder and a fixing device;
- and
- a second feed rail connecting the testing mechanism and the attachment mechanism, wherein the second feed rail is configured to transfer the light-emitting diodes, that passed the test of the test module, from the testing mechanism to the guiding feeder,
- wherein the guiding feeder is configured to arrange the light-emitting diodes, that passed the test of the test module, to align a circuit board, and wherein the fixing device is configured to bond the light-emitting diodes, that passed the test of the test module, to the circuit board.
Dependencies are inferred from the claim text.