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US 8,501,633 B2Granted
Forming substrate structure by filling recesses with deposition material
AssigneeSynos Technology, Inc.
InventorSang In Lee
Life of this patent
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Abstract
A substrate structure is produced by forming a first material layer on a substrate having a recess, removing the first material layer from the portion of the substrate except for the recess using a second material that reacts with the first material, and forming a deposition film from the first material layer using a third material that reacts with the first material. A method of manufacturing a device may include the method of forming a substrate structure.
Claims13
A method for forming a structure on a substrate formed with at least one recess, comprising:
- (a) depositing a layer of material on the substrate, the material deposited on surfaces within the at least one recess;
- (b) removing the deposited layer of material in first portions of the at least one recess shallower than a predetermined depth;
- (c) depositing another layer of material on the substrate and surfaces within the at least one recess;
- (d) removing the other layer of deposited material in the first portions of the at least one recess shallower than the predetermined;
- and
- (e) repeating (c) and (d) until second portions of the at least one recess at the predetermined depth and deeper than the predetermined depth are filled with the material.
3 more elements
Dependencies are inferred from the claim text.