Back to results
US 8,492,898 B2Granted
Printed circuit boards
AssigneeSemblant Global Limited
InventorsFrank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
Life of this patent
Estimating the term…
Abstract
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Claims35
A printed circuit board, comprising:
- a substrate comprising an insulating material;
- a plurality of conductive tracks attached to at least one surface of the substrate;
- a coating deposited on the at least one surface of the substrate, the coating covering at least a portion of the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer;
- at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the coating in a soldering process such that the solder joint abuts the coating;
- and
- wherein:
- the solder joint is formed on a particular region of the substrate after a substantially continuous layer of the coating is deposited on the substrate;
- and
- the soldering process removes the coating from the particular region of the substrate without removing the coating from other regions of the substrate.
6 more elements
The printed circuit board of 18, wherein:
- the particular electrical component is wire bonded through the coating to the at least one conductive track by a wire coated with the coating;
- and
- the wire bond is formed without first removing the coating from the wire.
A printed circuit board, comprising:
- a substrate comprising an insulating material;
- a plurality of conductive tracks attached to at least one surface of the substrate;
- and
- a coating deposited on the plurality of conductive tracks such that there is essentially no solder between the coating and the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer that allows a connection to be soldered through the coating in a soldering process to at least one conductive track to form a solder joint without first removing the coating from the at least one conductive track;
- and
- wherein:
- the solder joint is formed on a particular region of the substrate after a substantially continuous layer of the coating is deposited on the substrate;
- and
- the soldering process removes the coating from the particular region of the substrate without removing the coating from other regions of the substrate.
6 more elements
An apparatus, comprising:
- a substrate;
- a coating deposited on at least one surface of the substrate, the coating comprising at least one halo-hydrocarbon polymer;
- at least one metal contact between the substrate and the coating;
- and
- at least one electrical component connected by a solder joint to the at least one metal contact, wherein the solder joint is soldered through the coating in a soldering process such that the solder joint abuts the coating;
- and
- wherein:
- the solder joint is formed on a particular region of the substrate after a substantially continuous layer of the coating is deposited on the substrate;
- and
- the soldering process removes the coating from the particular region of the substrate without removing the coating from other regions of the substrate.
7 more elements
Dependencies are inferred from the claim text.