Process and apparatus for producing glass member provided with sealing material layer and process for producing electronic device

A process for producing an electronic device, the process comprising:

• (i) applying a sealing material paste to a second sealing region in the form of a frame on a second glass substrate, to produce a frame-form coating layer, wherein
• the sealing material paste is prepared by mixing a sealing material with an organic binder,
• the sealing material comprises a sealing glass and a laser absorbent,
• the second glass substrate comprises a second surface comprising the second sealing region which corresponds to a first sealing region on a first glass substrate, and
• the first glass substrate comprises a first surface comprising the first sealing region;
• (ii) irradiating the frame-form coating layer with a laser light for firing to heat the coating layer such that a heating temperature of the sealing material is within a range of at least (T+213° C.) and at most (T+480° C.) relative to a softening temperature T (° C.) of the sealing glass, thereby firing the sealing material while burning out the organic binder, to form a sealing material layer;
• (iii) laminating the first glass substrate and the second glass substrate with the sealing material layer, such that the first surface and the second surface face each other;
• and
• (iv) irradiating the sealing material layer with a laser light for sealing to melt the sealing material layer and thereby seal an electronic element portion situated between the first glass substrate and the second glass substrate,
• wherein:
• the irradiating (iv) of the sealing material layer occurs through the first glass substrate or the second glass substrate;
• the frame-form coating layer is irradiated (ii) with at least one laser light along it such that, relative to the softening temperature T (° C.) of the sealing glass:
• heating temperatures of the coating layer during an irradiation initiation period and during an irradiation completion period are within a range of at least (T+350° C.) and at most (T+550° C.);
• and
• a heating temperature of the coating layer during a scanning irradiation period is within a range of at least (T+213° C.) and at most (T+480° C.),
• such that a heating temperature of the coating layer during the irradiation initiation period is different than the heating temperature of the coating layer during the scanning irradiation period.