Non-uniform channel junction-less transistor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKen-Ichi Goto, Zhiqiang Wu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKen-Ichi Goto, Zhiqiang Wu
Estimating the term…
The present disclosure discloses a method of forming a semiconductor layer on a substrate. The method includes patterning the semiconductor layer into a fin structure. The method includes forming a gate dielectric layer and a gate electrode layer over the fin structure. The method includes patterning the gate dielectric layer and the gate electrode layer to form a gate structure in a manner so that the gate structure wraps around a portion of the fin structure. The method includes performing a plurality of implantation processes to form source/drain regions in the fin structure. The plurality of implantation processes are carried out in a manner so that a doping profile across the fin structure is non-uniform, and a first region of the portion of the fin structure that is wrapped around by the gate structure has a lower doping concentration level than other regions of the fin structure.
A semiconductor device, comprising:
A FinFET semiconductor device, comprising:
Dependencies are inferred from the claim text.