Methods of forming insulated wires and hermetically-sealed packages for use in electromagnetic devices

A method of forming a hermetically-sealed package for an electromagnetic device, the method comprising:

• coating a copper wire with a paste to form a coated wire, the paste comprising a first inorganic dielectric material, an organic binder, and a solvent;
• drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire;
• winding the green wire around a core to form a green assembly;
• subjecting the green assembly to a sintering temperature that is substantially equal to a softening point temperature of the first inorganic dielectric material to decompose the organic binder and form an intermediate assembly;
• vacuum impregnating an outer layer material into the intermediate assembly, the outer layer material comprising a second dielectric material selected from a group consisting of the first dielectric material and overglaze material having a formulation that is different than the first dielectric material, the second dielectric material having a melting point and including an organic material;
• drying the impregnated intermediate assembly at a second drying temperature in a vacuum or inert atmosphere to remove at least a portion of the solvent;
• heating the dried impregnated intermediate assembly at a decomposing temperature that is above the second drying temperature and below the second melting point of the second dielectric material to decompose the organic material of the second dielectric material;
• exposing the impregnated intermediate assembly to a densifying temperature in a vacuum or inert atmosphere, wherein the densifying temperature is equal to or above the melting point of the first and the second inorganic dielectric material to melt the first and the second dielectric material on the conductive wire;
• and
• sealing the assembly within a cylinder in a vacuum or inert atmosphere to form the hermetically-sealed package.