Wireless transceiver module

A wireless transceiver module, having a plurality of through holes, comprising:

• a wireless network chip comprising a first redistribution layer and a wireless network chip body, wherein the first redistribution layer is electrically connected to the wireless network chip body, and comprises a plurality of first bonding pads;
• a first circuit substrate;
• a Bluetooth chip disposed between the first circuit substrate and the wireless network chip, wherein the through holes are formed by passing through the wireless network chip, the first circuit substrate, and the Bluetooth chip, and the Bluetooth chip comprises a second redistribution layer and a Bluetooth chip body, and the second redistribution layer is electrically connected to the Bluetooth chip body and comprises a plurality of second bonding pads;
• a plurality of conductive connection structures disposed in the through holes respectively, wherein the Bluetooth chip, the wireless network chip, and the first circuit substrate are electrically connected with one another through the conductive connection structures, and the first circuit substrate comprises a plurality of third bonding pads, and the first bonding pads, the second bonding pads, and the third bonding pads are electrically connected to the conductive connection structures;
• and
• a second circuit substrate disposed on the wireless network chip.

A wireless transceiver module, having a plurality of through holes, comprising:

• a wireless network chip comprising a first redistribution layer and a wireless network chip body, wherein the first redistribution layer is electrically connected to the wireless network chip body, and comprises a plurality of first bonding pads;
• a first circuit substrate;
• a Bluetooth chip disposed between the first circuit substrate and the wireless network chip, wherein the through holes are formed by passing through the wireless network chip, the first circuit substrate, and the Bluetooth chip, and the Bluetooth chip comprises a second redistribution layer and a Bluetooth chip body, and the second redistribution layer is electrically connected to the Bluetooth chip body and comprises a plurality of second bonding pads;
• a second circuit substrate disposed on the wireless network chip, and comprising a plurality of fourth bonding pads;
• a plurality of conductive connection structures disposed in the through holes respectively, wherein the Bluetooth chip, the wireless network chip, and the first circuit substrate are electrically connected with one another through the conductive connection structures, and the first circuit substrate comprises a plurality of third bonding pads, and the first bonding pads, the second bonding pads, the third bonding pads, and the fourth bonding pads are electrically connected to the conductive connection structures;
• and
• a third circuit substrate disposed between the wireless network chip and the Bluetooth chip.