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US 8,477,814 B2Granted
Semiconductor laser module
AssigneeOSRAM Opto Semiconductors GmbH
InventorsThomas Schwarz, Michael Kuehnelt, Roland Schulz, Juergen Dachs, Ulrich Steegmueller, Heiko Unold
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Abstract
A semiconductor laser module is disclosed, comprising a module carrier (20) having a mounting area (21), a pump device (1) arranged on the mounting area (21), a surface emitting semiconductor laser (40) arranged on the mounting area (21), and a frequency conversion device (6) arranged on the mounting area (21), wherein the mounting area (21) of the module carrier (20) has an area content of at most 100 mm2.
Claims12
A semiconductor laser module comprising:
- a module carrier having a mounting area;
- a pump device arranged on the mounting area;
- a vertical external cavity surface emitting laser (VECSEL) arranged on the mounting area;
- and
- a frequency conversion device arranged on the mounting area,
- wherein the mounting area of the module carrier has an area content of at most 100 mm2, and
- wherein the VECSEL comprises:
- a mounting block having a side and a mounting area, and
- at least one semiconductor VECSEL chip arranged on the side of the mounting block,
- wherein the mounting area of the mounting block runs substantially perpendicular to the side of the mounting block, and
- wherein the semiconductor VECSEL chip is fixed with the mounting area of the mounting block on the mounting area of the module carrier, and
- wherein a height of the semiconductor laser module measured from a side of the module carrier remote from the mounting area to a highest extent of the semiconductor laser module is at most 3.5 mm.
9 more elements
A semiconductor laser module comprising:
- a module carrier having a mounting area;
- a pump device arranged on the mounting area;
- a vertical external cavity surface emitting laser (VECSEL) arranged on the mounting area;
- and
- a frequency conversion device arranged on the mounting area,
- wherein the mounting area of the module carrier has an area content of at most 100 mm2, and
- wherein the VECSEL comprises:
- a mounting block having a side and a mounting area, the mounting block being a non-metallic material, and
- at least one semiconductor VECSEL chip arranged on the side of the mounting block,
- wherein the mounting area of the mounting block runs substantially perpendicular to the side of the mounting block, and
- wherein the semiconductor VECSEL chip is fixed with the mounting area of the mounting block on the mounting area of the module carrier, and
- wherein a height of the semiconductor laser module is at most 3.5 mm.
9 more elements
Dependencies are inferred from the claim text.