Measurement method, measurement apparatus, exposure method, and exposure apparatus

A measurement method, of using a measurement system comprising an illumination optical system which illuminates a plurality of X marks and a plurality of Y marks, which are measurement objects formed on a prescribed substrate, with an illumination beam, and a light-receiving optical system which receives the beam from the marks, wherein

• the measurement system comprises, as a measurement condition which can be modified when measuring the marks, a light quantity of the illumination beam, NA or σ of the illumination optical system, an insertion or retraction of a phase-imparting member which imparts a prescribed phase difference to a diffraction beam of prescribed order arising from the marks, into or out of the optical path of the light-receiving optical system, and a signal processing condition when processing a photoelectric conversion signal obtained upon receiving the beam arising from the marks,
• the method comprising:
• when measuring the X marks on the prescribed substrate with the measurement system without measuring the Y marks, setting the measurement condition of the measurement system to a first condition, the X marks including all marks for measuring positions in a first direction in a two-dimensional plane on the substrate;
• and
• when measuring the Y marks on the prescribed substrate with the measurement system without measuring the X marks, setting the measurement condition of the measurement system to a second condition different from the first condition, the Y marks including all marks for measuring positions in a second direction orthogonal to the first direction in the two-dimensional plane on the substrate.

A method for measuring a plurality of X marks and a plurality of Y marks formed on a substrate by using a measurement system, the method comprising:

• setting a measurement condition for the measurement system to a first condition;
• measuring, with the measurement system, positions of all of the X marks under the first condition without measuring the Y marks, the X marks for measuring positions on the substrate in a first direction in a two-dimensional plane, the Y marks for measuring positions on the substrate in a second direction orthogonal to the first direction in the two-dimensional plane;
• switching the measurement condition from the first condition to a second condition after the measurement of all of the X marks;
• and
• measuring, with the measurement system, positions of all of the Y marks under the second direction without measuring the X marks.

A measurement method comprising:

• measuring a plurality of X marks on a substrate with a measurement system under a first condition without measuring the Y marks, the X marks each having line patterns that extend in a Y direction, the Y marks having line patterns that extend in an X direction, the X direction being orthogonal to the Y direction;
• after measuring X marks on the substrate under the first condition, switching the measurement condition from the first condition to a second condition, the second condition being different from the first condition;
• and
• measuring the Y marks on the substrate with the measurement system under the second condition without measuring the X marks.

A measurement method, of using a measurement system to measure a plurality of X marks and a plurality of Y marks as measurement objects formed on a prescribed substrate, comprising:

• a first process of setting a measurement condition for the measurement system to a first condition when measuring, with the measurement system, all of the Y marks among the marks which are the measurement objects on the prescribed substrate without measuring the X marks under the first condition, the X marks including all marks for measuring positions in a first direction in a two-dimensional plane on the substrate, the Y marks including all marks for measuring positions in a second direction orthogonal to the first direction in the two-dimensional plane on the substrate;
• a second process, after measuring all of the Y marks on the prescribed substrate under the first condition, of switching the measurement condition from the first condition and setting a second condition;
• and
• a third process of measuring, with the measurement system, all of the X marks without measuring the Y marks, under the second condition.

A method for measuring a plurality of X marks and a plurality of Y marks formed on a substrate by using a measurement system, the method comprising:

• setting a measurement condition for the measurement system to a first condition;
• measuring, with the measurement system, positions of all of the Y marks under the first condition without measuring the X marks, the X marks for measuring positions on the substrate in a first direction in a two-dimensional plane, the Y marks for measuring positions on the substrate in a second direction orthogonal to the first direction in the two-dimensional plane;
• switching the measurement condition from the first condition to a second condition after the measurement of all of the Y marks;
• and
• measuring, with the measurement system, positions of all of the X marks under the second condition without measuring the Y marks.

A measurement method comprising:

• measuring Y marks on a substrate with a measurement system under a first condition without measuring X marks on the substrate, the X marks each having line patterns that extend in a Y direction, the Y marks each having line patterns that extend in an X direction, the X direction being orthogonal to the Y direction;
• after measuring the Y marks on the substrate under the first condition, switching the measurement condition from the first condition to a second condition, the second condition being different from the first condition;
• and
• measuring the X marks on the substrate with the measurement system under the second condition without measuring the Y marks.