Radio frequency (RF) particles
AssigneePhiltech Inc.
InventorYuji Furumura
Life of this patent
Estimating the term…
Abstract
The present disclosure generally describes radio frequency (RF) particles and an RF powder-containing base including a plurality of such RF particles. The RF particles may include an antenna element and an integrated circuit element coupled together by at least one interconnection. The base may be formed from sheet-like subjects, such as various kinds of cards, bills, and documents. Methods of forming the RF powder-containing base are also generally disclosed.
Claims16
A radio frequency particle, comprising:
- an integrated circuit overlying and in direct contact with a substrate;
- an insulating layer overlying and in direct contact with the integrated circuit such that the integrated circuit is positioned between the substrate and the insulating layer;
- an antenna element overlying and in direct contact with the insulating layer;
- and at least one interconnection coupling the integrated circuit with the antenna element,
- wherein a longest side of the radio frequency particle is less than or equal to 0.30 millimeters.
A radio frequency powder-containing base, comprising:
- a plurality of radio frequency powder particles dispersed in the base, each of the radio frequency powder particles, comprising:
- an integrated circuit overlying a substrate;
- an insulating layer overlying the integrated circuit;
- at least one antenna element disposed in the insulating layer and having an exposed surface;
- and
- at least one interconnection extending from the integrated circuit to the antenna element,
- wherein the plurality of radio frequency powder particles comprises first particles sensitive to electromagnetic waves having a first frequency and second particles sensitive to electromagnetic waves having a second frequency, the first frequency being different from the second frequency.
A method of forming a base including a plurality of radio frequency powder particles, each of the radio frequency particles comprising an integrated circuit overlying a substrate, an insulating layer overlying the integrated circuit, at least one antenna element disposed in the insulating layer and having an exposed surface, and at least one interconnection extending from the integrated circuit to the antenna element, the method comprising:
- forming a first adhesive-containing solution containing the first radio frequency powder particles responsive to electromagnetic waves having a first frequency;
- forming a second adhesive-containing solution containing the second radio frequency powder particles responsive to electromagnetic waves having a second frequency different from the first frequency;
- and
- applying the first and second adhesive-containing solutions to the base.
Dependencies are inferred from the claim text.