3D integrated circuit stack-wide synchronization circuit
AssigneeInternational Business Machines Corporation
InventorsJoel A. Silberman, Matthew R. Wordeman
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsJoel A. Silberman, Matthew R. Wordeman
Estimating the term…
There is provided a synchronization circuit for a 3D chip stack having multiple circuits and multiple strata interconnected using a first and a second stack-wide broadcast connection chain. The synchronization circuit includes the following, on each stratum. A synchronizer connected to the first connection chain receives an asynchronous signal therefrom and performs a synchronization to provide a synchronous signal. A driver is connected to the second chain for driving the synchronous signal. A latch connected to the second chain receives the synchronous signal driven by the driver on a same or different stratum within a next clock cycle from the synchronization to provide the stack-wide synchronous signal to a circuit on a same stratum. An output of a single driver on one stratum is selected at any given time for use by the latch on all strata.
A stack-wide synchronization circuit for providing a stack-wide synchronous signal to each stratum of a 3D chip stack having multiple circuits and two or more strata interconnected using at least a first and a second connection chain, each of the first and the second connection chains being in a stack-wide broadcast configuration, the stack-wide synchronization circuit comprising, on each of the two or more strata:
A method for providing a stack-wide synchronous signal to each stratum of a 3D chip stack having multiple circuits and two or more strata interconnected using at least a first and a second connection chain, each of the first and the second connection chains being in a stack-wide broadcast configuration, the method comprising:
A method for providing a stack-wide synchronous signal to each stratum of a 3D chip stack having multiple circuits and two or more strata interconnected using at least a first and a second connection chain, each of the first and the second connection chains being in a stack-wide broadcast configuration, the method comprising:
A stack-wide synchronization circuit for synchronizing an asynchronous signal in each stratum of a 3D chip stack having two or more strata interconnected using at least a first and a second chain of vias, each of the first and the second chain of vias being in a stack-wide broadcast configuration, the stack-wide synchronization circuit comprising, on each of the two or more strata:
Dependencies are inferred from the claim text.