Piezoelectric device and piezoelectric device manufacturing method
AssigneeSeiko Epson Corporation
InventorYukihiro Hashi
Life of this patent
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Abstract
A piezoelectric device includes: a first substrate; a second substrate disposed opposed to the first substrate; a third substrate disposed between the first substrate and the second substrate, a part of the third substrate forming a piezoelectric oscillating piece, and another part of the third substrate forming a frame which surrounds the piezoelectric oscillating piece; a first metal film which joins the first substrate and the frame; a second metal film which joins the second substrate and the frame; and a resin portion provided at least at any one of positions between the first substrate and the first metal film, between the frame and the first metal film, between the second substrate and the second metal film, and between the frame and the second metal film.
Claims5
A piezoelectric device comprising:
- a first substrate;
- a second substrate disposed opposite to the first substrate;
- a third substrate disposed between the first substrate and the second substrate, a part of the third substrate forming a piezoelectric oscillating piece having a piezoelectric oscillating electrode, and another part of the third substrate forming a frame that surrounds the piezoelectric oscillating piece;
- a first metal film that joins the first substrate and the frame;
- a second metal film that joins the second substrate and the frame;
- a resin portion provided at least at any one of positions between the first substrate and the first metal film, between the frame and the first metal film, between the second substrate and the second metal film, and between the frame and the second metal film, and
- a bump electrode that is formed on the first substrate, wherein
- the bump electrode has a resin projection projecting toward the third substrate and a bump conductive film covering the resin projection, and
- the piezoelectric oscillating electrode is electrically connected with the bump conductive film.
A piezoelectric device manufacturing method for manufacturing a piezoelectric device that includes a first substrate, a second substrate disposed opposite to the first substrate and joined to the first substrate with a third substrate interposed between the first and second substrates, a part of the third substrate forming a piezoelectric oscillating piece having piezoelectric oscillating electrode, and another part of the third substrate forming a frame that surrounds the piezoelectric oscillating piece, comprising:
- forming a first metal film disposed between the first substrate and the frame;
- forming a second metal film disposed between the second substrate and the frame;
- forming a plurality of resin portions at positions between any of the first substrate and the first metal film, the frame and the first metal film, the second substrate and the second metal film, and the frame and the second metal film by using a resin material;
- joining the first substrate and the frame by the first metal film;
- joining the second substrate and the frame by the second metal film;
- forming one of the resin portions on an area of the first substrate that faces the frame,
- forming a resin projection on the area that corresponds to the piezoelectric oscillating electrode;
- and
- forming a bump conductive film, which is electrically connected with the piezoelectric oscillating electrode, on the resin projection to form a bump electrode.
Dependencies are inferred from the claim text.