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US 8,476,809 B2Granted
Microelectromechanical systems (MEMS) resonators and related apparatus and methods
AssigneeSand 9, Inc.
InventorsDavid M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel
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Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Claims17
A packaged micromechanical resonator, comprising:
- a substrate;
- a cap lacking integrated circuitry;
- a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;
- a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume;
- and
- a second portion of the electrically conductive material between the substrate and the cap and configured to conduct a signal between the micromechanical resonator and the cap.
3 more elements
Dependencies are inferred from the claim text.