Integrated circuit packaging system with embedded interconnect and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsJoungIn Yang, YoungSik Cho, SungHyun Lee
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit with an adhesive attached thereto; connecting the integrated circuit and a plated interconnect pad; attaching an embedded interconnect to the plated interconnect pad; and forming an encapsulation, having an encapsulation first side and an encapsulation second side, around the integrated circuit, the embedded interconnect, and the plated interconnect pad with the embedded interconnect exposed from the encapsulation second side and the plated interconnect pad and the adhesive exposed from the encapsulation second side.
Claims20
An integrated circuit packaging system comprising:
- an integrated circuit;
- an adhesive attached to the integrated circuit;
- a plated interconnect pad connected to the integrated circuit;
- an embedded interconnect, having an elliptical shape, attached to the plated interconnect pad;
- an internal interconnect connected between the integrated circuit and the plated interconnect pad, the internal interconnect in direct contact with no intervening element to the plated interconnect pad on the side of the plated interconnect pad attached to the embedded interconnect;
- and
- an encapsulation, having an encapsulation first side and an encapsulation second side, around the integrated circuit, the embedded interconnect, and the plated interconnect pad with the embedded interconnect exposed from the encapsulation second side, the plated interconnect pad and the adhesive coplanar with the encapsulation first side and exposed from the encapsulation first side, and the elliptical shape of the embedded interconnects forming a mold interlock with the encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing an integrated circuit with an adhesive attached thereto;
- connecting the integrated circuit and a plated interconnect pad;
- attaching an embedded interconnect, having an elliptical shape, to the plated interconnect pad;
- connecting an internal interconnect between the integrated circuit and the plated interconnect pad, the internal interconnect in direct contact with no intervening element to the plated interconnect pad on the side of the plated interconnect pad attached to the embedded interconnect;
- and
- forming an encapsulation, having an encapsulation first side and an encapsulation second side, around the integrated circuit, the embedded interconnect, and the plated interconnect pad with the embedded interconnect exposed from the encapsulation second side, the plated interconnect pad and the adhesive coplanar with the encapsulation first side and exposed from the encapsulation first side, and the elliptical shape of the embedded interconnect forming a mold interlock with the encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing an integrated circuit with an adhesive attached thereto;
- connecting an internal interconnect between the integrated circuit and a plated interconnect pad with the plated interconnect pad adjacent to the integrated circuit;
- attaching an embedded interconnect, having an elliptical shape, to the plated interconnect pad;
- connecting an internal interconnect between the integrated circuit and the plated interconnect pad, the internal interconnect in direct contact with no intervening element to the plated interconnect pad on the side of the plated interconnect pad attached to the embedded interconnect;
- and
- forming an encapsulation, having an encapsulation first side and an encapsulation second side, around the integrated circuit, the embedded interconnect, and the plated interconnect pad with the embedded interconnect exposed from the encapsulation second side, the plated interconnect pad and the adhesive coplanar with the encapsulation first side and exposed from the encapsulation first side, and the elliptical shape of the embedded interconnects forming a mold interlock with the encapsulation.
Dependencies are inferred from the claim text.